Model Name SATADOM-ML 3MG2-P SATADOM-SL 3ME3 SATADOM-SV 3ME3 SATADOM-SH Type C 3ME3 Key Features 1. Vertical and low-profile design for 1U server 2. High IOPS 3. Write protect 4. High performance SATADOM 1. Vertical and low-profile design for 1U server 2. High IOPS 3. Best boot drive solution 4. Lower power consumption 1. Vertical version 2. High IOPS 3. Best boot drive solution 1. Low profile horizontal design 2. High IOPS Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC MLC MLC Capacity 32GB-256GB 4GB-128GB 4GB~128GB 4GB~128GB Max. Channel 4 2 2 2 Sequential R/W (MB/sec, max.) 560/180 200/75 200/75 200/75 Max. Power Consumption 2.68W(5V x 535mA) 0.65W(5V x 125mA) 0.65W(5V x 125mA) 0.65W (5V x 125mA) Thermal Sensor Y N N N External DRAM Buffer Y N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 37.17 x 31.5 x 12.6 32.9 x 29.5 x 8.0 20.9 x 39.5 x 7.9 18.0 x 30.3 x 12.5 Environment Vibration: 20G@7~2000Hz Shock: 1500G@0.5ms Storage Temperature: -55°C ~ +95°C MTBF: >3 million StandardTemp.OP(0°C~+70°C) DGSML-XXXD81BC***# DESSL-XXXD09SC***# DESSV-XXXD09SC***# DESSC-XXXD09SC***# WideTemp.OP (-40°C~+85°C) DGSML-XXXD81BW***# DESSL-XXXD09SW***# DESSV-XXXD09SW***# DESSC-XXXD09SW***# Notes xxx = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 / F=Pin 7) Model Name SATADOM-SH Type D 3ME3 SATADOM-MV 3ME3 SATADOM-ML 3ME3 SATADOM-MH 3ME3 Key Features 1. Low profile horizontal design 2. High IOPS 1. Vertical version. 2. High IOPS 3. Write protect 4. Supports TRIM 1. Low-profile design for 1U server 2. High IOPS 3. Write protect 1. Horizontal design 2. High IOPS 3. Write protect Interface SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s SATA III 6.0Gb/s Flash Type MLC MLC MLC MLC Capacity 4GB~128GB 16GB-128GB 16GB-256GB 8GB-128GB Max. Channel 2 4 4 2 Sequential R/W (MB/sec, max.) 200/75 355/135 355/135 200/75 Max. Power Consumption 0.65W(5V x 125mA) 1W(5V x 200mA) 1W(5V x 200mA) 1W(5V x 200mA) Thermal Sensor STD : N , W/T : Y External DRAM Buffer N N N N iData Guard Y Y Y Y iCell N N N N TRIM Y Y Y Y ATA Security Y Y Y Y S.M.A.R.T Y Y Y Y Dimension (WxLxH/mm) 30.0 x 27.5 x 12.0 25.3 x 41.5 x 6.8 35.5 x 30 x 9.5 40.0 x 30.0 x 12.3 Environment Vibration: 20G@7~2000Hz Shock: 1500G@0.5ms Storage Temperature: -55°C ~ +95°C MTBF: >3 million StandardTemp.OP(0°C~+70°C) DESSF-XXXD09SC***# DESMV-XXXD09SC***# DESMV-XXXD08SC***# DESML-XXXD08SC***# DESMH-XXXD09SC***# WideTemp.OP (-40°C~+85°C) DESSF-XXXD09SW***# DESMV-XXXD09SW***# DESMV-XXXD08SW***# DESML-XXXD08SW***# DESMH-XXXD09SW***# Notes xxx = density (02GB=02G, 04GB=04G, 08GB=08G, 16GB=16G, 32GB=32G, 64GB=64G, 128GB=A28, 256GB=B56, 512GB=C12) ***= flash configuration (internal control code) #=power supply method(A=pin 8+ external power cable / B=Pin 7+ Pin 8 / F=Pin 7) Table of Contents