Thermal Conductance: >350,000W/m2 °C (0.001 inch layer)
High-Density
Controlled Triple-Phase Viscosity
Not Electrically Conductive
Performance
Coverage Area
Mfr Part Number: AS5-12G
Features:
Contains 99.9% pure silver
High-Density(contains over 88% thermally conductive filler by
weight)
Controlled Tripple-Phase Viscosity
Not Electrically Conductive and Absolute Stability (will not
separate, run, migrate, or bleed)
Thermal Conductance: >300,000W/m2 °C (0.001 inch layer)
Thermal Resistance: <0.0045°C-in2/Watt (0.001 inch layer)
Average Particle Size: <0.49 microns <0.000020 inch
Extended Temperature Limits: Peak: -50°C to >180°C
Long-Term: -50°C to 130°C
Performance:
3 to 12 degrees centigrade lower CPU full load core temperatures than
standard thermal compounds or thermal pads when measured with a
calibrated thermal diode imbedded in the CPU core
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